SoC for mid-range smartphones.
Taiwanese MediaTek continues to expand its SoC Dimensity line. The new chipset is called Dimensity 820. It occupies an intermediate place between the flagship Dimensity 1000 and gaming chips Helio G90.
Dimensity 820 is built on the 7 nm FinFET process technology. It consists of four Cortex-A76 cores (2.6 GHz) and four Cortex-A55 cores (2.0 GHz). The graphics processor is responsible for the Mali-G57 accelerator. Technology supported HyperEngine 2.0, which improves the performance of smartphones during games.
The chipset is compatible with Full HD + displays operating with a refresh rate of up to 120 Hz. Technology support also claimed Miravisionthat improves the display of content on the screen. Imagiq 5.0 image processing processor is capable of working with camera modules with a resolution of up to 80 MP.
Dimensity 820 has an integrated 5G modem; it supports operation at sub-6 GHz frequency both in stand-alone and non-stand-alone networks. Also declared support for Dual SIM Standby, Dynamic Spectrum Sharing, Voice Over New Radio and others.
One of the first smartphones to receive the Dimensity 820 chipset will be Xiaomi Redmi 10X.